fabrication platform,welding platen

Thermal conductivity prediction of underfill and its affects on the flip chip temperature field;

底充胶导热系数预测及对倒装焊温度场的影响

Affects of Low Thermal Expansion Coefficient under fill on Reliability of Flip Chip Solder Joint;

低膨胀系数底充胶对倒装焊焊点疲劳可靠性的影响

The Probabilistic Designing of the Parameters of Flip Chip Microelectronic Package;

倒装焊微电子封装结构参数的概率设计